Job Details:

Job Description:
About APCC:

Be a part of Intel’s Advanced Packaging Command Center (APCC), the global command center for Advanced Packaging that provides remote capabilities, follow-on engineering, and operational support across Wafer Packaging Manufacturing (WPM). Through APCC, engineering expertise is focused to improve coordination across regions, drive standardization, and improve responsiveness, while strengthening end-to-end operational execution across regions and delivering consistent, high-quality execution at scale.

Key Contribution:

As a valued team member, you will:

• Monitor and analyze real-time factory operations.
• Collaborate closely with stakeholders to enable effective communication and coordination.
• Support high equipment availability and predictable manufacturing results.
• Help sustain Intel’s leadership in advanced packaging manufacturing.
   
  A Remote Operations Center (ROC) Manufacturing Technician (MT) is responsible for managing factory operations in a high-volume manufacturing (HVM) facility from centralized computer workstations off the manufacturing floor. 

Job responsibilities will include but will not be limited to: 

• Plan and execute production material movement across all processes in WPM functions from a given remote workstation.
• Monitor fab equipment health and availability and communicate clearly with production personnel to ensure production is operational fully.
• Respond to equipment alarms at ROC and resolve them with collaboration from production personnel.
• Execute real-time disposition on equipment alarms and production lots when required.
• Monitor, manage, and troubleshoot all equipment errors and material flows adhering to safety, quality and output values as required.
• Understand and perform complex production instructions with inputs from multiple stakeholders.
• Complete shiftly documentation and effectively communicate progress with global team.
• Improve workstation performance by actively participating in continuous improvement projects, learning and skill development.

Qualifications:
Minimum qualifications are required to be initially considered for this position.

• Diploma in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics / Chemical Process Engineering / Chemistry / Physics.
• 1+ years of working experience in semiconductor manufacturing, wafer fabrication, advanced packaging, or manufacturing operations environments.
• Fresh graduates are encouraged to apply.
• Ability to work rotating shifts to provide continuous support across global manufacturing operations. Day shift time is from 6:50 am to 7:00 pm and night shift is 6:50 pm to 7:00 a.m. Please note that this schedule is subject to change at the discretion of the Management.
• Strong English communication skills, including reading, writing, and verbal communication.
• Experience with end-user computer skills and navigation and automation systems troubleshooting.
   
  Preferred Qualifications:
• Experience training others
• Peer leadership
• Data analysis skills
• Effective communication and teamwork skills in a global, cross-functional environment.
• Willingness to learn new technologies, inspection platforms, and manufacturing processes.
   
  An ideal candidate should be willing to demonstrate the below behavioural traits: 
• Judgment and initiative are required in resolving complex nonstandard problems and developing recommendations
• Commitment with quality
• Strong team and communication skills
• Problem solving skills
• Adjust to changing priorities in a fast-paced environment
   
  Primary Location:
  Malaysia, Penang

          

Job Type:
Intel Contract Employee

Shift:
Shift 9 A1 (Malaysia)

Primary Location:
Malaysia, Penang

Additional Locations:

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Job Details:

Job Description:
About APCC:

Be a part of Intel’s Advanced Packaging Command Center (APCC), the global command center for Advanced Packaging that provides remote capabilities, follow-on engineering, and operational support across Wafer Packaging Manufacturing (WPM). Through APCC, engineering expertise is focused to improve coordination across regions, drive standardization, and improve responsiveness, while strengthening end-to-end operational execution across regions and delivering consistent, high-quality execution at scale.

Key Contribution:

As a valued team member, you will:

• Monitor and analyze real-time factory operations.
• Collaborate closely with stakeholders to enable effective communication and coordination.
• Support high equipment availability and predictable manufacturing results.
• Help sustain Intel’s leadership in advanced packaging manufacturing.
   
  A Remote Operations Center (ROC) Manufacturing Technician (MT) is responsible for managing factory operations in a high-volume manufacturing (HVM) facility from centralized computer workstations off the manufacturing floor. 

Job responsibilities will include but will not be limited to: 

• Plan and execute production material movement across all processes in WPM functions from a given remote workstation.
• Monitor fab equipment health and availability and communicate clearly with production personnel to ensure production is operational fully.
• Respond to equipment alarms at ROC and resolve them with collaboration from production personnel.
• Execute real-time disposition on equipment alarms and production lots when required.
• Monitor, manage, and troubleshoot all equipment errors and material flows adhering to safety, quality and output values as required.
• Understand and perform complex production instructions with inputs from multiple stakeholders.
• Complete shiftly documentation and effectively communicate progress with global team.
• Improve workstation performance by actively participating in continuous improvement projects, learning and skill development.

Qualifications:
Minimum qualifications are required to be initially considered for this position.

• Diploma in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics / Chemical Process Engineering / Chemistry / Physics.
• 1+ years of working experience in semiconductor manufacturing, wafer fabrication, advanced packaging, or manufacturing operations environments.
• Fresh graduates are encouraged to apply.
• Ability to work rotating shifts to provide continuous support across global manufacturing operations. Day shift time is from 6:50 am to 7:00 pm and night shift is 6:50 pm to 7:00 a.m. Please note that this schedule is subject to change at the discretion of the Management.
• Strong English communication skills, including reading, writing, and verbal communication.
• Experience with end-user computer skills and navigation and automation systems troubleshooting.
   
  Preferred Qualifications:
• Experience training others
• Peer leadership
• Data analysis skills
• Effective communication and teamwork skills in a global, cross-functional environment.
• Willingness to learn new technologies, inspection platforms, and manufacturing processes.
   
  An ideal candidate should be willing to demonstrate the below behavioural traits: 
• Judgment and initiative are required in resolving complex nonstandard problems and developing recommendations
• Commitment with quality
• Strong team and communication skills
• Problem solving skills
• Adjust to changing priorities in a fast-paced environment
   
  Primary Location:
  Malaysia, Penang

          

Job Type:
Intel Contract Employee

Shift:
Shift 9 A1 (Malaysia)

Primary Location:
Malaysia, Penang

Additional Locations:

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.