Job Details:

Job Description:
The Role and Impact:
In this hands-on Module Engineer role, you will be at the forefront of optimizing high-volume manufacturing processes that drive innovation in semiconductor production. You will oversee critical equipment and processes, conduct tests to ensure adherence to quality standards, and implement enhancements to maximize efficiency and output. Your work will have a direct impact on delivering high-quality products that enable Intel’s cutting-edge technology.

Business group:
As part of Intel Corporation, you will join a team dedicated to advancing device miniaturization and scaling high-volume manufacturing processes. This group focuses on driving innovation, improving efficiencies, and transferring technology globally to ensure seamless production across Intel’s manufacturing sites. Your contributions will support Intel’s mission of creating world-changing technology that enriches lives.

Key Responsibilities:

• Own and optimize manufacturing equipment and processes to enhance production efficiency, quality, and cost-effectiveness.
• Conduct tests and measurements to maintain control over critical dimensions and defectivity in the process line.
• Recommend and implement modifications to improve equipment performance and production output.
• Collaborate with manufacturing sites globally to transfer technology and ensure processing consistency.
• Execute maintenance and repair activities for equipment and module components.
• Drive continuous improvement initiatives for safety, quality, and yield metrics.
• Utilize data-driven problem-solving techniques to detect and address discrepant materials or activities.
• Manage equipment install, conversion, and qualification during factory ramps to ensure safety, schedule adherence, and quality compliance.

Qualifications:
Minimum Qualifications:

• Bachelor’s degree in Materials, Mechanical, Chemical, or Electrical Engineering, or a related field.
• 3+ years of hands-on experience in semiconductor assembly processes such as die attach/TCB, flip-chip, or similar technologies.
• Strong knowledge of Cu pillar/microbump metallurgy, wetting, thermomechanical behavior, and fine-pitch alignment.
• Proficiency in statistical process control (SPC) and data-driven problem-solving methodologies.
• Experience with metrology analytics tools, such as X-ray inspection, warpage measurement, optical inspection (AOI), and microscopy.
• Ability to work in a cleanroom environment (Class 10k-100k) with required personal protective equipment (PPE).

Preferred Qualifications:

• Demonstrated ability to work collaboratively across teams to achieve aggressive output and quality targets.
• Strong communication and organizational skills to influence cross-functional groups.
• Experience leading continuous improvement initiatives in manufacturing environments.

Your expertise will play a pivotal role in shaping Intel’s manufacturing excellence. Take the next step in your career and contribute to the technologies that power the future.

          

Job Type:
Experienced Hire

Shift:
Shift 1 (Malaysia)

Primary Location:
Malaysia, Kulim

Additional Locations:

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Job Details:

Job Description:
The Role and Impact:
In this hands-on Module Engineer role, you will be at the forefront of optimizing high-volume manufacturing processes that drive innovation in semiconductor production. You will oversee critical equipment and processes, conduct tests to ensure adherence to quality standards, and implement enhancements to maximize efficiency and output. Your work will have a direct impact on delivering high-quality products that enable Intel’s cutting-edge technology.

Business group:
As part of Intel Corporation, you will join a team dedicated to advancing device miniaturization and scaling high-volume manufacturing processes. This group focuses on driving innovation, improving efficiencies, and transferring technology globally to ensure seamless production across Intel’s manufacturing sites. Your contributions will support Intel’s mission of creating world-changing technology that enriches lives.

Key Responsibilities:

• Own and optimize manufacturing equipment and processes to enhance production efficiency, quality, and cost-effectiveness.
• Conduct tests and measurements to maintain control over critical dimensions and defectivity in the process line.
• Recommend and implement modifications to improve equipment performance and production output.
• Collaborate with manufacturing sites globally to transfer technology and ensure processing consistency.
• Execute maintenance and repair activities for equipment and module components.
• Drive continuous improvement initiatives for safety, quality, and yield metrics.
• Utilize data-driven problem-solving techniques to detect and address discrepant materials or activities.
• Manage equipment install, conversion, and qualification during factory ramps to ensure safety, schedule adherence, and quality compliance.

Qualifications:
Minimum Qualifications:

• Bachelor’s degree in Materials, Mechanical, Chemical, or Electrical Engineering, or a related field.
• 3+ years of hands-on experience in semiconductor assembly processes such as die attach/TCB, flip-chip, or similar technologies.
• Strong knowledge of Cu pillar/microbump metallurgy, wetting, thermomechanical behavior, and fine-pitch alignment.
• Proficiency in statistical process control (SPC) and data-driven problem-solving methodologies.
• Experience with metrology analytics tools, such as X-ray inspection, warpage measurement, optical inspection (AOI), and microscopy.
• Ability to work in a cleanroom environment (Class 10k-100k) with required personal protective equipment (PPE).

Preferred Qualifications:

• Demonstrated ability to work collaboratively across teams to achieve aggressive output and quality targets.
• Strong communication and organizational skills to influence cross-functional groups.
• Experience leading continuous improvement initiatives in manufacturing environments.

Your expertise will play a pivotal role in shaping Intel’s manufacturing excellence. Take the next step in your career and contribute to the technologies that power the future.

          

Job Type:
Experienced Hire

Shift:
Shift 1 (Malaysia)

Primary Location:
Malaysia, Kulim

Additional Locations:

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.