Job Details:

Job Description:
The Role and Impact
As a Manufacturing Engineering Undergraduate Intern, you will play a pivotal role in supporting the development and optimization of automation and AI-driven solutions for package failure analysis. Your contributions will include scripting and automation on LYA and FA tools, developing AI models for data interpretation and defect detection, and preparing inspection datasets such as CSAM, iTDR and IR images. By assisting with model training, validation, and benchmarking, your work will directly enhance analysis efficiency, reduce manual inspection time, improve throughput, and ensure scalable failure analysis capabilities.

Business Group
Intel Foundry focuses on strengthening Intel’s manufacturing capabilities and operational excellence to deliver high-quality products and solutions. As part of the Penang Package FA LYA team, you’ll collaborate with cross-functional engineering teams to support process innovation and efficiency improvements that align with Intel’s broader business objectives. This group fosters a dynamic, collaborative environment aimed at driving technological advancements and maintaining Intel’s leadership in the industry.

Key Responsibilities

• Contribute to the development of automation scripting for package failure analysis processes.
• Develop semi or automated data collection methods on both LYA and FA tools to speed up dataturn
• Assist in AI model development and validation for defect detection.
• Prepare inspection datasets, including CSAM and infrared laser scanning confocal images, for analysis.
• Support benchmarking workflows and compare AI-driven analysis against manual methods.
• Document workflows, results, and observations to ensure traceability and consistency in processes.
• Collaborate with cross-functional engineering teams to enhance production efficiency and product quality.
• Adhere to safety protocols and data governance requirements.

Qualifications:
Minimum Qualifications

• Actively pursuing a bachelor’s degree in Mechanical Engineering, Electrical Engineering, a cross-disciplinary blend of Materials Science, Computer Science, or a related field.
• Proficiency in data analysis tools or programming languages such as Python, MATLAB, or similar.
• Familiarity with AI methodologies, automation processes, or failure analysis techniques.
• Demonstrated aptitude for problem-solving and attention to detail through academic projects, internships, coursework, or hands-on training.
• Strong collaboration and communication skills demonstrated through team-based projects or internships.
• Able to commit to a minimum internship period of 3 to 6 months, subject to university/college internship requirements and academic calendar.

Your contributions will support Intel’s commitment to innovation and excellence while providing valuable learning experiences through hands-on projects. Apply today to explore a future with Intel and make an impact in advancing manufacturing engineering solutions.

          

Job Type:
Student / Intern

Shift:
Shift 1 (Malaysia)

Primary Location:
Malaysia, Penang

Additional Locations:

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Job Details:

Job Description:
The Role and Impact
As a Manufacturing Engineering Undergraduate Intern, you will play a pivotal role in supporting the development and optimization of automation and AI-driven solutions for package failure analysis. Your contributions will include scripting and automation on LYA and FA tools, developing AI models for data interpretation and defect detection, and preparing inspection datasets such as CSAM, iTDR and IR images. By assisting with model training, validation, and benchmarking, your work will directly enhance analysis efficiency, reduce manual inspection time, improve throughput, and ensure scalable failure analysis capabilities.

Business Group
Intel Foundry focuses on strengthening Intel’s manufacturing capabilities and operational excellence to deliver high-quality products and solutions. As part of the Penang Package FA LYA team, you’ll collaborate with cross-functional engineering teams to support process innovation and efficiency improvements that align with Intel’s broader business objectives. This group fosters a dynamic, collaborative environment aimed at driving technological advancements and maintaining Intel’s leadership in the industry.

Key Responsibilities

• Contribute to the development of automation scripting for package failure analysis processes.
• Develop semi or automated data collection methods on both LYA and FA tools to speed up dataturn
• Assist in AI model development and validation for defect detection.
• Prepare inspection datasets, including CSAM and infrared laser scanning confocal images, for analysis.
• Support benchmarking workflows and compare AI-driven analysis against manual methods.
• Document workflows, results, and observations to ensure traceability and consistency in processes.
• Collaborate with cross-functional engineering teams to enhance production efficiency and product quality.
• Adhere to safety protocols and data governance requirements.

Qualifications:
Minimum Qualifications

• Actively pursuing a bachelor’s degree in Mechanical Engineering, Electrical Engineering, a cross-disciplinary blend of Materials Science, Computer Science, or a related field.
• Proficiency in data analysis tools or programming languages such as Python, MATLAB, or similar.
• Familiarity with AI methodologies, automation processes, or failure analysis techniques.
• Demonstrated aptitude for problem-solving and attention to detail through academic projects, internships, coursework, or hands-on training.
• Strong collaboration and communication skills demonstrated through team-based projects or internships.
• Able to commit to a minimum internship period of 3 to 6 months, subject to university/college internship requirements and academic calendar.

Your contributions will support Intel’s commitment to innovation and excellence while providing valuable learning experiences through hands-on projects. Apply today to explore a future with Intel and make an impact in advancing manufacturing engineering solutions.

          

Job Type:
Student / Intern

Shift:
Shift 1 (Malaysia)

Primary Location:
Malaysia, Penang

Additional Locations:

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.