Job Details:

Job Description:
Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located in Kulim as a Handling Systems development engineer leading the development and deployment of Intel’s advanced chip packaging process technology.

In this position, you will be directly responsible for developing material handling technology involving high accuracy and high-speed pick-n-place systems for next generation semiconductor packaging technology. Your responsibilities include, but are not limited to:

• Development of handling process recipes, design/validation of nozzle tooling, and addressing process/equipment issues on the manufacturing floor while delivering to our quality and reliability standards.
• Engaging in testing and validating hardware/software upgrades to meet product requirements.
• Develop solutions to meet customer requirements from platform specification to validation, deployment and proliferation to high volume manufacturing sites.
• Drive improvements in quality, reliability, cost, yield, process stability, productivity and safety/ergonomics.
• Apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.

Qualifications:
Minimum Qualifications:

• Possess a Bachelor’s or Master’s degree in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering or related STEM field.
• Have at least 1 year of work experience.
• Experience with and fundamental understanding of motion control, high accuracy/speed robotic systems, and vision systems.
• Fundamental understanding of semiconductor devices and packing technology.

Preferred Qualifications:

• Proven development & deployment experience in factory automated material handling systems, including Autonomous Mobile Robot (AMR)/Automated Guided Vehicle (AGV), conveyor systems, stockers, automated storage solutions and manufacturing equipment integration. Familiarity with advanced autonomous manufacturing concepts (Level 5 & above automation) is preferred.
• Strong kinematics / motion control / vision systems background (High speed / high accuracy pick-n-place, 2D vision systems).
• Mechanical design experience (CAD, Solidwork, GD and T) is preferred.
• Strong understanding of statistical principles, statistical process control (SPC) and Design of Experiments (DOE).
• Ability to apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.

          

Job Type:
Experienced Hire

Shift:
Shift 1 (Malaysia)

Primary Location:
Malaysia, Kulim

Additional Locations:

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Job Details:

Job Description:
Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located in Kulim as a Handling Systems development engineer leading the development and deployment of Intel’s advanced chip packaging process technology.

In this position, you will be directly responsible for developing material handling technology involving high accuracy and high-speed pick-n-place systems for next generation semiconductor packaging technology. Your responsibilities include, but are not limited to:

• Development of handling process recipes, design/validation of nozzle tooling, and addressing process/equipment issues on the manufacturing floor while delivering to our quality and reliability standards.
• Engaging in testing and validating hardware/software upgrades to meet product requirements.
• Develop solutions to meet customer requirements from platform specification to validation, deployment and proliferation to high volume manufacturing sites.
• Drive improvements in quality, reliability, cost, yield, process stability, productivity and safety/ergonomics.
• Apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.

Qualifications:
Minimum Qualifications:

• Possess a Bachelor’s or Master’s degree in Robotics and Autonomous Systems, Mechanical Engineering, Electrical Engineering or related STEM field.
• Have at least 1 year of work experience.
• Experience with and fundamental understanding of motion control, high accuracy/speed robotic systems, and vision systems.
• Fundamental understanding of semiconductor devices and packing technology.

Preferred Qualifications:

• Proven development & deployment experience in factory automated material handling systems, including Autonomous Mobile Robot (AMR)/Automated Guided Vehicle (AGV), conveyor systems, stockers, automated storage solutions and manufacturing equipment integration. Familiarity with advanced autonomous manufacturing concepts (Level 5 & above automation) is preferred.
• Strong kinematics / motion control / vision systems background (High speed / high accuracy pick-n-place, 2D vision systems).
• Mechanical design experience (CAD, Solidwork, GD and T) is preferred.
• Strong understanding of statistical principles, statistical process control (SPC) and Design of Experiments (DOE).
• Ability to apply fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.

          

Job Type:
Experienced Hire

Shift:
Shift 1 (Malaysia)

Primary Location:
Malaysia, Kulim

Additional Locations:

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.